Application

Case study

Industry/Application

Advanced Packaging Wafer Ball Size Inspection

Back bore hole depth measurement, up to 8mm deep hole

High-end IC carrier bore hole depth measurement

Solar cell silicon suede pyramid, grid line measurement

Surface topography analysis of metal film and polymer film for micromachining of 3C electronic products

Measurement of an inverted pyramid structure on a transparent material

Semiconductor gold wire bonding measurement,gold wire diameter of about 10μm, large spatialAngle, extended to 3C, optical module, etc

Measurement of the depth and width of the cutting groove after the wafer laser cutting

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