The AI-driven computing power race is reshaping the logic of semiconductor hardware manufacturing. Advanced process nodes continue to shrink toward the nanoscale, while 2.5D/3D packaging has achieved large-scale adoption, driving a surge in demand for high-end PCBs such as HDI boards and IC substrates. Consequently, yield control on production lines now faces unprecedentedly stringent requirements. According to data from several authoritative institutions, the global advanced packaging market reached approximately US$54 billion in 2025 and is projected to exceed US$80 billion by 2030. The sustained expansion of advanced packaging capacity is simultaneously boosting the scale of the metrology market; the ability to perform accurate and reliable measurements directly determines the upper limit of high-end manufacturing capacity. However, when confronted with complex conditions—such as micro-bumps on wafer surfaces, deep-aspect-ratio trenches, highly reflective metallic surfaces, and multilayer transparent materials—traditional 2D vision systems and conventional 3D metrology solutions struggle to simultaneously meet the dual demands of sub-micron measurement accuracy and industrial-grade inspection throughput. As a result, non-contact, high-efficiency optical 3D metrology has become an essential component in high-end manufacturing processes.

AI image generation

However, for a long time, the high-end optical 3D measurement market has been dominated by overseas giants, with scarce domestic solutions. The procurement cost of a single unit of high-end overseas equipment often runs into millions of yuan, and when coupled with ever-increasing post-purchase maintenance expenses, it significantly drives up capital and operating expenditures for domestic manufacturing enterprises. Even more challenging than cost is the issue of technical compatibility. Domestic semiconductor and new-energy production lines evolve at a rapid pace, with complex and customized process requirements, yet the underlying software and SDKs of most overseas equipment are not open. Under the current macro trade environment, fluctuations in the supply of core metrology equipment further threaten the stable operation of the entire micro- and nano-manufacturing industry chain. For these reasons, what the domestic market urgently needs is not just metrology equipment that can meet high-precision technical specifications, but also robust domestic solutions that offer deep local adaptation and ensure independent and controllable supply chains. Hubei TrueLight 3D Sensing Technology Ltd. is precisely the game-changer in this field.

TrueLight 3D Sensing’s technological strength stems from the more than 20 years of research in micro- and nano-optics by the Instrument Science and Technology team at Huazhong University of Science and Technology. By achieving independent control over the entire value chain—from underlying algorithms and core optical path design to the complete system—TrueLight 3D Sensing has fundamentally broken the overseas technology monopoly and addressed the risk of supply-chain bottlenecks.

As the flagship product lineup for tackling complex micro- and nano-scale morphology inspection, TrueLight 3D Sensing’s confocal 3D microscopes and micro-sensors offer compatible 2D and 3D observation, measurement, and analysis capabilities, truly achieving multi-functionality in a single device. The products employ wide-field imaging and area-array light scanning technologies, with Z-axis measurement accuracy spanning the 1 nm to 1 μm range and a maximum measurement range of up to 30 mm, thus meeting both ultra-high precision and ultra-large measurement range requirements. They also boast exceptional adaptability across various materials and structures, enabling high-speed imaging in just seconds. Supported by long-life LED light sources and remote maintenance design, they ensure low-cost operation throughout the entire lifecycle, while the fully open SDK can be thoroughly customized to meet the specific needs of domestic production lines.

To date, the technology has been successfully deployed across multiple industries, including semiconductor wafers, chip packaging, AI-accelerated PCBs, microfabrication, 3C precision optical components, and new energy. It has also achieved mature applications in key scenarios such as HBM wafer bump inspection and critical dimension metrology for IC substrates.

To meet the demand for online inspection of large height differences and high-speed motion, TrueLight 3D Sensing has launched a precision tool—the line-scan spectral confocal 3D sensor. The product is equipped with a self-developed integrated sensing-and-computing parallel computing architecture SOC, achieving a scanning speed of up to 2,000 Hz under a wide depth of field. Coupled with a high-precision dual-axis optical path design and CMOS chip, it enables ultra-high-speed online inspection. It boasts high adaptability and easy integration, supports remote parameter adjustment and SDK updates, features low maintenance costs, and can seamlessly integrate with various automated production lines. It has already been deployed in industries such as chip packaging, 3C electronics, and new energy, and is suitable for high-speed production scenarios like flexible screen inspection and measurement of lithium battery structural components.

LC-B Series Line-Spectrum Confocal 3D Sensor

Domestication is just the starting point; global expansion is the future. TrueLight 3D Sensing’s vision goes beyond achieving domestic substitution; it is committed to empowering global micro- and nano-manufacturing and research customers with industry-leading optical 3D sensing and metrology solutions.

Seeing is believing—after all, the true strength of precision instruments can only be proven through actual measurements. From March 18 to 20, 2026, TrueLight 3D Sensing will make a grand appearance at LASER World of PHOTONICS CHINA 2026, showcasing its portfolio of area-confocal 3D microscopes, area-confocal 3D micro-sensors, and line-spectrum confocal 3D sensors, thereby highlighting China’s R&D achievements and commercial potential in the field of high-end optical sensors.

We cordially invite experts and partners from the global semiconductor, broader semiconductor, and micro- and nano-manufacturing industries to visit Booth 7376 in Hall E7 at the Shanghai New International Expo Center. A real-world measurement environment will be set up on-site, where you are welcome to bring your most challenging production-line samples to jointly explore cutting-edge solutions for 3D optical metrology and witness the rise of a new domestic force in the field of precision metrology!