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2026-04-20

TrueLight 3D Sensing made its debut at the National Defense and Military Industry Exhibition, successfully concluding a new journey of deep cultivation in the military market!

On April 18, the three-day Chengdu National Defense and Military Industry Exhibition came to a close. Hubei TrueLight 3D Sensing Technology Ltd. made its debut at this specialized exhibition in the military industry sub-sector, impressing the audience with its cutting-edge technology and mature solutions, and achieving complete success in its participation.

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2026-04-20

3551 “Star” Talent | Li Min: Embedding Nanometer-Precision into the World’s Leading Computing Ecosystem

“It allows a star’s deviation to be hidden within nanometer-level precision; it permits the calibration of instrument gaps, even humming a slightly off-key tune. This beam of light does not inquire about the destination—it only illuminates all your focused, earnest, and passionate prisms.” As you step into Hubei TrueLight 3D Sensing Technology Ltd. (hereinafter referred to as “TrueLight 3D”), this passage in the elevator lobby is both romantic and transparent.

2026-03-23

Closing Ceremony | TrueLight 3D Sensing’s Trip to the Munich Shanghai Optics Fair Comes to a Successful Close

Time flies, and the grand event has come to a close. On March 20, TrueLight 3D Sensing’s three-day journey at the Munich Shanghai Optical Fair officially drew to a successful conclusion. During these brief three days of the exhibition, there was no lengthy small talk—only mutual dedication and intellectual exchange among industry peers. Every pause, every conversation, and every expression of recognition have become the most precious marks of this journey, giving us a clearer direction and stronger confidence for the future of optical precision measurement.

2026-03-13

How can domestically produced confocal 3D microscopes break the deadlock in high-end optical metrology?

The AI-driven computing power race is reshaping the logic of semiconductor hardware manufacturing. Advanced process nodes continue to shrink toward the nanometer scale, 2.5D/3D packaging is being deployed at scale, and demand for high-end PCBs—such as HDI boards and IC substrates—is surging, placing unprecedentedly stringent requirements on yield control across production lines. According to data from several authoritative institutions, the global advanced packaging market reached approximately US$54 billion in 2025 and is projected to exceed US$80 billion by 2030. The sustained expansion of advanced packaging capacity is driving parallel growth in the metrology market; the ability to measure accurately and reliably directly determines the upper limit of high-end manufacturing capacity. However, when confronted with complex conditions—such as micro-bumps on wafer surfaces, high-aspect-ratio trenches, highly reflective metal surfaces, and multi-layer transparent materials—traditional 2D vision systems and conventional 3D metrology solutions struggle to simultaneously meet the dual demands of sub-micron measurement accuracy and industrial-grade inspection throughput. As a result, non-contact, high-efficiency optical 3D metrology has become an essential capability in high-end manufacturing processes.

2026-03-05

Honored Listing | TrueLight 3D Sensing Named Among Wuhan’s First Batch of AI Root Enterprises

Recently, the Wuhan Municipal Bureau of Economy and Information Technology announced the list of the first batch of 20 AI root enterprises in Wuhan, among which TrueLight 3D Sensing was successfully selected.

2025-03-21

Backed by Huazhong University of Science and Technology's technology team, a Wuhan high-end equipment company receives tens of millions in financing | Hard Krypton exclusive

TrueLight 3D Sensing, a domestic manufacturer of precision optical imaging instruments, has completed tens of millions of yuan in angel+ round financing, according to Hard Krypton. The investors are Yuanhe Origin, Optics Valley Investment, and Changshu National Development Venture Capital, with angel round investor Peakview Capital continuing to invest. This round of financing will primarily be used for the continued R&D of the current optical 3D imaging technology platform and the establishment of a market team, accelerating the commercialization process.

2025-03-21

TrueLight 3D Sensing Completes Tens of Millions of Yuan in Angel+ Round Funding, Led by Yuanhe Origin

TrueLight 3D Sensing relies on the Instrument Science and Technology Department of Huazhong University of Science and Technology and a team of expert researchers, possessing numerous core patents and abundant technological reserves.

2025-03-10

Global Launch of TrueLight 3D Sensing Confocal Series Products

2025-03-10

Revolutionary 3D microscopic imaging product - TrueLight 3D Sensing confocal series products global launch

Based on the principle of wide-field microscopy, structural light illumination is used to modulate the surface information of the object being measured, removing out-of-focus signal interference. A three-dimensional micro-surface topography is obtained through vertical axial scanning. It is suitable for both complex feature surfaces (such as scattering surfaces) and smooth surfaces. The Z-axis accuracy can be flexibly adjusted to cover the range from 1 nm to 1 μm, depending on the application scenario. This technology breaks through the barriers of traditional technologies and core components such as laser confocal microscopy, extended depth of field, and white light interference. It adopts a unique surface array optical scanning confocal technology, bringing higher efficiency and stronger imaging capabilities.

2024-03-19

Hubei TrueLight 3D Sensing's outstanding alumni visited Hubei Normal University to reveal the secrets of FPGA and ARM development to communication students.

On the morning of March 16, 2024, Qin Feihu, the technical director of Hubei TrueLight 3D Sensing Technology Ltd. and an outstanding graduate alumnus, was invited to Hubei Normal University. He used his weekend to give a wonderful hardware course to freshmen, sophomores, and juniors majoring in communication engineering. Accompanying him were faculty members Hu Baiyan, Wen Furong, and Tong Yu. In the course, Master Brother Feihu and his company's ARM experts gave a detailed explanation of the creation and debugging process of FPGA and ARM development projects, unveiling the mystery of hardware technology for the students.

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86-027-86636858

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Wuhan Headquarters:Floor 1 & 4, Entrance D, Building 2, Innovation Base, Huazhong University Of Science And Technology, Wuhan

Suzhou Office Address:Room 606, Building 5, Sip Ic Industrial Park, No.11 Yangfu Road, Suzhou Industrial Park, Huqiu District, Suzhou City

Shenzhen Office Address:Block B, Building 1, Shangzhi Science Park, 380 Guangming Avenue, Guangming District, Shenzhen 1405

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E-mail：zhanglinwei@truelight3d.com

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