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AMS Areal confocal 3D microscope


New generation fully autonomous desktop confocal 3D microscope/profiler
areal scanning, cross-scale, true color, fast imaging

Technical Principle

  Based on the principle of widefield microscopy, it utilizes structured light illumination to modulate the surface information of the object, removing out-of-focus signal interference. A 3D micro-surface topography is obtained through vertical axial scanning. It is suitable for both complex feature surfaces (such as scattering surfaces) and smooth surfaces. The Z-axis accuracy can be flexibly adjusted from 1nm to 1μm according to the application scenario.

World's first commercially available product with "array light + confocal imaging" technology

  ● Unique areal light scanning confocal technology brings higher efficiency and stronger imaging capabilities
  ● Cross-scale, cross-material, cross-structure compatibility
  ● Integrating artificial intelligence to explore more application possibilities

Schematic Diagram

 

Product Features

  ● New generation fully autonomous desktop confocal 3D microscope/profiler

  ● Surface scanning, cross-scale, true color, fast imaging

Product

  Cross-scale compatibility:Compatible with high-precision mode (limit 1nm) and long-range (30mm), submicron precision mode

  High Adaptability:Adaptable to smooth surfaces, complex surfaces, highly reflective materials, and transparent materials

  Multifunctional:Measurement of roughness, warp/flatness, three-dimensional profile, size, XY large field of view stitching, surface image, etc.

  Low Maintenance Cost:LED light source, stable, reliable, and long lifespan

  Openness:Supports export of original true color images and 3D point clouds for convenient AI analysis

Confocal 3D Microscope Product Image

 

 

Product Introduction

Cross-scale Application

==>

1 Confocal 3D Microscope = 1 Laser Confocal 3D Microscope + 1 Super-depth 3D Microscope
mirror + 1 super depth of field 3D microscope

Traditional Technology Products

 

Application Types

①Super-depth Microscope Digital 

②3D Microscope Laser Confocal 

③3D Microscope White 

④Light Interferometer

<==substitute

applications==>

①Defect observation and analysis 

②Key dimension measurement 

③Surface profile 

④analysis Roughness detection 

⑤Transparent film thickness detection...

 

Model Name

AM 100 (Large Range)

AM 10 (High Precision)AM 1 (Ultra-high Precision)

Principle

White light confocal

White light confocal

White light confocal

Axial Scanning Device

Motor

PZT+motor

PZT+motor

Axial accuracy(μm)

0.1

0.01 (PZT), 0.1 (Motor)

0.001 (PZT), 0.1 (Motor)

Range  μm

30000

500 (PZT), 30000 (Motor)

400 (PZT), 30000 (Motor)

XY Stage mm

100  x  100

100  x  100

100  x  100

Size (HxWxD) mm

780 x  475 x  595

780 x  475 x  595

780 x  475 x  595

Weight (kg)

55

55

55

Optional Objective

Microscope Objective Magnification5X10X20X50X100X150X
Numerical Aperture NA0.150.30.450.80.90.9
Working Distance mm23.517.54.5111.5
Measurement XY Field of View mm2.24 × 1.401.12 × 0.700.56 × 0.350.22 × 0.140.11 × 0.070.07 × 0.04
Measurement XY Point Interval μm1.1720.5860.2930.1170.0590.039

Note

①Limited by the objective lens working distance, the maximum range is 30mm; motor stroke 100mm;

②Can be customized according to requirements, supporting size matching, such as 12-inch wafers;

③Objective lens is not standard; select objective lens according to usage needs;

④A complete microscope includes a measuring head, objective lens, base, controller and display, measurement software, gauge blocks, among which the objective lens and gauge blocks are optional.

Case

Solar cell silicon suede pyramid, grid line measurement

PV application: Solar cell silicon suede pyramid, grid line measurement

High-end IC carrier bore hole depth measurement

High-end PCB manufacturing:Laser drilling of IC substrate application: High-end IC carrier bore hole depth measurement

Back bore hole depth measurement, up to 8mm deep hole

High-end PCB manufacturing:back drilling Application: Back bore hole depth measurement, up to 8mm deep hole

Measurement of the depth and width of the cutting groove after the wafer laser cutting

OSAT (Front-End) application: Measurement of the depth and width of the cutting groove after the wafer laser cutting

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